LCS2™ Waffle Pack Lid/Clip Super System
Developed in partnership BAE Systems, Gel-Pak’s patent pending Lid/Clip Super System (LCS2) prevents thin semiconductor die from migrating out of waffle pack/chip tray pockets during shipping and handling. The lid is designed to work with a new highly engineered clip that uniformly compresses the tray and lid together.
![LCS2 Modified Cross Bar.1](https://www.gelpak.com/wp-content/uploads/2021/07/LCS2-Modified-Cross-Bar.1.png)
- “Gold” colored ESD Class 0 static dissipative molded lid and clip (SR < E9 ohms)
- Padded lid with integrated industry standard static dissipative Tyvek
- Eliminates the costly and laborious manual placement and misalignment and/or pinching of Tyvek inserts when loading waffle pack
- Silicone-free
- Compensates for common waffle pack lid/tray warpage that creates gaps that enable die migration
- Uniformly seals each individual tray pocket
- Saves significant costs associated with yield loss, rework labor and RMAs caused by die migration issue. 50% reduction in assembly labor
![Updatedd_Diagram_with_Tyvek](/wp-content/uploads/2022/07/Updatedd_Diagram_with_Tyvek.jpg)
Part Numbers:
GP-LCS2-LID-T: LCS2 Gold Padded Lid w/ White Tyvek Interleaf Material
GP-LCS2-CLIP: LCS2 Gold Clip