LCS2™ Waffle Pack Lid/Clip Super System

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Gel-Pak 2” LCS2 Lid/Clip System for Waffle Packs

Gel-Pak’s LCS2® Lid/Clip System prevents thin semiconductor die (<250µm) from migrating out of waffle pack/chip tray pockets during shipping and handling. The lid is designed to work with a new highly engineered clip that uniformly compresses the tray and lid together.

  • Eliminates die migration
  • Eliminates costly and laborious manual placement and misalignment and/or pinching of Tyvek inserts when loading waffle packs
  • Compensation for common waffle pack lid/tray warpage that create gaps that enable migration
Vacuum Release Sizes 2”
Device Size <250 µm
Product Construction Static dissipative molded lid with foam pad and Tyvek adhered to inside. Static dissipative molded clip.
Lid/Clip Materials Gold colored static dissipative lid and clip
Surface Resistance <E9 (ohms)

LCS2 Part Number Catalog

Part Number Description
GP-LCS2-LID-T 2″ Gold LCS2, Tyvek (No Clip)
GP-LCS2-CLIP 2″ Gold LCS2 Clip (no Lid)
GP-22C-93S-T 2″Black conductive padded lid, Tyvek (No clip)

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