Gel-Probe: Revolutionizing Probe Cleaning and Polishing Posted on February 27, 2025 (February 27, 2025) by JastMedia ☰ Quick Links × Quick Links E-Store Request Quote Request Sample Contact Technical Support Product Selection Wizard Calculate Number Of Devices/Carrier Gel-Pak Brochure At Gel-Pak, innovation is at the heart of everything we do. One of the areas in which we continue to innovate is the Gel-Probe™ product line, which is designed to meet the evolving needs of the semiconductor test market. Working collaboratively with the industry’s leading probe card manufactures, we have optimized a suite of Gel-Probe products and successfully qualified them as appropriate for both the in-line and off-line cleaning of probe cards. The materials have been found to effectively clean probe tips, control contact resistance (Cres), and in many cases outperform other polymer-based probe card cleaning sheets and wafers. Gel-Probe™ Products The Gel-Probe™ product line includes three main categories: Gel-Probe REFINE™, Gel-Probe REMOVE™, and Gel-Probe RECOVER™. Each product is meticulously engineered to address specific cleaning and polishing requirements, making them indispensable tools for semiconductor manufacturers. Gel-Probe REMOVE™: Cleaning Excellence Gel-Probe REMOVE™ products are designed for all types of cantilvered probe needle materials, as well as advanced vertical and array technologies. They consist of a nonabrasive Gel elastomer material that efficiently removes and captures loose debris from probe tips. Gel-Probe REFINE™: Polishing Perfection Gel-Probe REFINE™ products are designed for both offline and online probe polishing applications. They consist of a proprietary Gel elastomer material uniformly blended with abrasive particles, providing an effective solution for eliminating embedded and bonded debris from probe tips. Gel-Probe RECOVER™: Reshaping Innovation Gel-Probe RECOVER™ products are designed for cantilevered probe technologies, offering an economical way to uniformly reshape the surface area of new and worn flat probe tips. They form smooth, radius tips with optimized contact surfaces, ensuring consistent and reliable performance during testing Gel-Probe products are available in a sheet format as well as 200 mm, 300 mm and optional 150 mm wafer formats. Why Choose Gel-Probe™ Products? Non-conductive and non-corrosive: Ensures no residue transfer to probes or bond pads. Wide operating temperature range: – 60˚C to +200˚C Customizable solutions Rapid, stable CRES Recovery Reduced tip wear Improved cleaning efficiency Short lead times Customer-Centric Innovation At Gel-Pak, we believe in co-creating solutions with our customers. Our technical strategy focuses on customer partnerships and operational excellence, enabling us to develop products that address long-term roadmaps and solve specific challenges. As a trusted partner to some of the world’s leading probe card manufacturers, we are committed to delivering operational efficiency, ensuring data quality, and maximizing yields for the semiconductor market. Conclusion The Gel-Probe™ product line is a testament to Gel-Pak’s commitment to innovation and excellence. By providing advanced cleaning, polishing, and reshaping solutions, we help semiconductor manufacturers achieve optimal performance and reliability in their testing processes. Explore our Gel-Probe™ products today and experience the difference in probe cleaning and polishing technology. For more information, visit our Gel-Probe™ product page. Gel-Pak's experienced technical support staff is available to answer your questions related to products or associated applications. Contact Us!