Probe Tip Polishing Wafers and Sheets
Gel-Probe Refine wafers and sheets consist of a proprietary Gel elastomer polishing material uniformly blended with abrasive particles offered in sheet and 200mm/300mm wafer format.
- Removes embedded and bonded debris from probe tips
- Captures loose particles created during probing process
- Lightly polishes the entire probe surface, tip length, and shaft in a non-destructive manner
- Non-conductive, non-corrosive
- Does not transfer residue to probes or bond pads
- Exerts force on probes in only “Z” (vertical) direction and the force is less than that imparted during normal test conditions with no lateral force applied to probe tips
- Standard and custom constructions available
Product Features
| PRODUCT | ABRASIVE LOADING | OPERATING TEMP |
|---|---|---|
| Gel-Probe REFINE L3 |
Low Load (~70%) 3µm SiC | -60˚C to +200˚C |
| Gel-Probe REFINE M3 |
Medium Load (~99%) 3µm SiC | -60˚C to +200˚C |
| Gel-Probe REFINE H3 |
High Load (~150%) 3µm SiC | -60˚C to +200˚C |
| Gel-Probe REFINE U3 |
Ultra-High Load (~300%) 3µm SiC | -60˚C to +200˚C |
Gel-Probe ReFine Polishing Wafer Cross Section
| COVER SHEET - Peel off prior to use |
| POLISHING GEL Elastomer = 233µm |
| 200mm WAFER 725µm -or- 300mm WAFER 775µm |
*Graphic not to scale
- 200mm Wafer stack height:
958 ± 30µm - 300mm Wafer stack height:
1008 ± 30µm
Gel-Probe ReFine Polishing Sheets Cross Section
| COVER SHEET - Peel off prior to use |
| POLISHING GEL Elastomer = 233µm |
| POLYIMIDE Backing |
| Adhesive PSA |
| Backside Release Liner - Peel off prior to use |
*Graphic not to scale
- Nominal stack height:
385 ± 20µm